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EM MICROELECTRONIC - MARIN SA
EM4100
Read Only Contactless Identification Device
Description
The EM4100 (previously named H4100) is a CMOS integrated circuit for use in electronic Read Only RF Transponders. The circuit is powered by an external coil placed in an electromagnetic field, and gets its master clock from the same field via one of the coil terminals. By turning on and off the modulation current, the chip will send back the 64 bits of information contained in a factor y preprogrammed memory array. The programming of the chip is performed by laser fusing of polysilicon links in order to store a unique code on each chip. The EM4100 has several metal options which are used to define the code type and data rate. Data rates of 64, 32 and 16 periods of carrier frequency per data bit are available. Data can be coded as Manchester, Biphase or PSK. Due to low power consumption of the logic core, no supply buffer capacitor is required. Only an external coil is needed to obtain the chip function. A parallel resonance capacitor of 74 pF is also integrated.
Features
64 bit memory array laser programmable Several options of data rate and coding available On chip resonance capacitor On chip supply buffer capacitor On chip voltage limiter Full wave rectifier on chip Large modulation depth due to a low impedance modulation device Operating frequency 100 - 150 kHz Very small chip size convenient for implantation Very low power consumption
Applications
Logistics automation Anticounterfeiting Access control Industrial transponder
Typical Operating Configuration
Pin Assignment
Coil1
VSS VDD
EM4100
EM4100 Coil2
L: typical 21.9mH for fo = 125kHz COIL1 COIL2
Fig. 1
COIL2
COIL1
Coil terminal / Clock input Coil terminal
Fig. 2
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EM4100
Absolute Maximum Ratings
Parameter Maximum DC Current forced on COIL1 & COIL2 Power Supply Storage Temp. Die form Storage Temp. PCB form Electrostatic discharge maximum to MIL-STD-883C method 3015 Symbol ICOIL VDD Tstore Tstore VESD Conditions 30mA -0.3 to 7.5V -55 to +200C -55 to +125C 1000V *) The AC Voltage on Coil is limited by the on chip voltage limitation circuitry. This is according to the parameter Icoil in the absolute maximum ratings.
Operating Conditions
Parameter Operating Temp. Maximum Coil Current AC Voltage on Coil Supply Frequency Symbol Top ICOIL Vcoil fcoil 3 100 14* 150 Min. -40 Typ. Max. Units C +85 10 mA Vpp kHz
Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure beyond specified operating conditions max affect device reliability or cause malfunction.
Handling Procedures
This device has built-in protection against high static voltages or electric fields; however due to the unique properties of this device, anti-static precautions should be taken as for any other CMOS component.
System Principle
Tranceiver
Transponder Coil1
Oscillator
Antenna Driver
EM4100 Coil2
Filter and Gain
Demodulator
Data decoder
Data received from transponder
Signal on coils
Transponder coil
Transeiver coil
RF Carrier
Data
Fig. 3
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EM4100
Electrical Characteristics VDD = 1.5V, VSS = 0V, fC1 = 134kHz square wave, Ta = 25C VC1 = 1.0V with positive peak at VDD and negative peak at VDD -1V unless otherwise specified Parameter
Supply Voltage Rectified Supply Voltage Coil1 - Coil2 Capacitance Power Supply Capacitor Biphase & Manchester Versions Supply Current C2 pad Modulator ON voltage drop C1 pad Modulator ON voltage drop PSK Version Supply Current PSK C2 pad Modulator ON voltage drop
Note 1) Note 2)
Symbol Test Conditions
VDD VDDREC Cres Csup IDD VONC2 VONC1 IDDPSK VONC2PSK VDD=1.5V IVDDC2=100A with ref. to VDD VDD=1.5V VDD=5.0V VDD=5.0V IVDDC2=100A with ref. to VDD IVDDC2=1mA with ref. to VDD IVDDC1=1mA with ref. to VDD VCOIL1 - VCOIL2 = 2.8 VDC Modulator switch = "ON" Vcoil=100mVRMS f=10kHz
Min.
1.5 1.5
Typ.
Max.
1)
Units
V V
74 2) 120 0.63 0.9 2.1 2.1 1.1 2.3 2.3 1.5 1.3 2.8 2.8
pF pF A V V V
0.92 0.3 0.6
2 0.9
A V
The maximum voltage is defined by forcing 10mA on COIL1 - COIL2 The tolerance of the resonant capacitor is 15% over the whole production. Optional reduced tolerance on request On a wafer basis, the tolerance is 2%
Timing Characteristics
VDD = 1.5V, VSS = 0V, fcoil = 134kHz square wave, Ta = 25C VC1 = 1.0V with positive peak at VDD and negative peak at VDD -1V unless otherwise specified Timings are derived from the field frequency and are specified as a number of RF periods. Parameter Read Bit Period Symbol Trdb Test Conditions depending on option Value 64, 32, 16 Units RF periods
Timing Waveforms
TOC COIL1 64, 32 or 16 TOC, depending on option
Serial Data Out
BIT n
BIT n+1
BIT n+2
Fig. 4
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EM4100
Block Diagram
CLOCK EXTRACTOR
a COIL1 VDD
AC1
Logic Clock
Cres
+
FULL WAVE RECTIFIER
AC2 -
Csup
SEQUENCER
MEMORY ARRAY
COIL2
VSS Serial Data Out
DATA MODULATOR DATA ENCODER
Modulation Control
a: open only for PSK version
Fig. 5
Functional Description
General The EM4100 is supplied by means of an electromagnetic field induced on the attached coil. The AC voltage is rectified in order to provide a DC internal supply voltage. When the last bit is sent, the chip will continue with the first bit until the power goes off. Full Wave Rectifier The AC input induced in the external coil by an incident magnetic field is rectified by a Graetz bridge. The bridge will limit the internal DC voltage to avoid malfunction in strong fields. Clock Extractor One of the coil terminals (COIL1) is used to generate the master clock for the logic function. The output of the clock extractor drives a sequencer. Sequencer The sequencer provides all necessary signals to address the memory array and to encode the serial data out. Three mask programmed encoding versions of logic are available. These three encoding types are Manchester, biphase and PSK. The bit rate for the first and the second type can be 64 or 32 periods of the field frequency. For the PSK version, the bit rate is 16. The sequencer receives its clock from the COIL1 clock extractor and generates every internal signal controlling the memory and the data encoder logic.
Data Modulator The data modulator is controlled by the signal Modulation Control in order to induce a high current in the coil. In the PSK version, only COIL2 transistor drives this high current. In the other versions, both coil1 and coil2 transistors drive it to Vdd. This will affect the magnetic field according to the data stored in the memory array. Resonance Capacitor This capacitor can be trimmed in factory by 0.5pf steps to achieve the absolute value of 74pf typically. This option, which is on request, allows a smaller capacitor tolerance on the whole of the production.
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EM4100
Memory Array for Manchester & Bi-Phase encoding ICs The EM4100 contains 64 bits divided in five groups of information. 9 bits are used for the header, 10 row parity bits (P0-P9), 4 column parity bits (PC0-PC3), 40 data bits (D00-D93), and 1 stop bit set to logic 0. Memory Array for PSK encoding ICs The PSK coded IC's are programmed with odd parity for P0 and P1 and always with a logic zero. The parity bits from P2 to P9 are even. The column parity PC0 to PC3 are calculated including the version bits and are even parity bits. Code Description Manchester There is always a transition from ON to OFF or from OFF to ON in the middle of bit period. At the transition from logic bit "1" to logic bit "0" or logic bit "0" to logic bit "1" the phase change. Value high of data stream presented below modulator switch OFF, low represents switch ON (see Fig. 6). Biphase Code At the beginning of each bit, a transition will occur. A logic bit "1" will keep its state for the whole bit duration and a logic bit "0" will show a transition in the middle of the bit duration (see Fig. 7). PSK Code Modulation switch goes ON and OFF alternately every period of carrier frequency. When a phase shift occurs, a logical "0" is read from the memory. If no shift phase occurs after a data rate cycle, a logical "1" is read (see Fig. 8).
1 1 1 8 version bits or customer ID 32 data bits
1
1 1 D00 D01 D10 D11 D20 D21 D30 D31 D40 D41 D50 D51 D60 D61 D70 D71 D80 D81 D90 D91 PC0 PC1
1 D02 D12 D22 D32 D42 D52 D62 D72 D82 D92 PC2
1 D03 D13 D23 D33 D43 D53 D63 D73 D83 D93 PC3
1 P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 S0
9 header bits
10 line parity bits
4 column parity bits
The header is composed of the 9 first bits which are all mask programmed to "1". Due to the data and parity organisation, this sequence cannot be reproduced in the data string. The header is followed by 10 groups of 4 data bits allowing 100 billion combinations and 1 even row parity bit. Then, the last group consists of 4 event column parity bits without row parity bit. S0 is a stop bit which is written to "0" Bits D00 to D03 and bits D10 to D13 are customer specific identification. These 64 bits are outputted serially in order to control the modulator. When the 64 bits data string is outputted, the output sequence is repeated continuously until power goes off.
Manchester Code
Binary data Memory output Modulator control Modulation control "low" means high current
Fig. 6
X
1
1
1
1
1
1
1
1
1
0
1
0
1
0
0
0
1
1
0
Biphase Code
Binary data Memory output
0
1
1
0
1
0
0
1
Modulator control Modulation control "low" means high current
Fig. 7
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EM4100
PSK Code
Serial Data Out COIL1 Modulator control
"0" ON SERIAL OUT
"1" ON SERIAL OUT
Modulation control "low" means high current
Fig. 8
Typical Performance Characteristics
Typical Capacitor Variation versus Temperature
101
Dynamic Consumption Versus temperature with VddVss=1.5V
1.4 1.2 1 PSK Manchester and biphase
Resonnance capacitor [%]
100.8 100.6
Idyn [A]
100.4 100.2 100 99.8 99.6 -50 -25 0 25 50 75 100
0.8 0.6 0.4 0.2 0 -50 -25
0
25
50
75
100
Temperature [C]
Temperature [ C ]
Fig. 9
Fig. 10
L versus Resonance Frequency versus for a typical coil capacitance of 74 pf
Rectified Voltage versus temperature for Vcoil2-Vcoil1=2.8V
40 35
2 1.95 1.9
Lcoil [mH]
30 25 20 15 10 100
Vddrec [V]
1.85 1.8 1.75 1.7 1.65
110
120
130
140
150
-50
-25
0
25
50
75
100
Frequency [KHz]
Temperature [C]
Fig. 11
Fig. 12
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EM4100
CHIP Dimensions
EM4100
14 1041 499 747
517
142
378
716
Y
1016
X Vss, Vdd pad size : 76 X 76 C1, C2 pad size : 95 X 95 All dimensions in m
Fig. 13
CID Package
FRONT VIEW
PCB Package
Y Z
J
K
TOP VIEW B
D
MARKING AREA
A R e C2 C1
SYMBOL A B D e F g J K R
MIN 8.2 3.8 5.8 0.38 1.25 0.3 0.42 0.115 0.4
TYP 8.5 4.0 6.0 0.5 1.3 0.4 0.44 0.127 0.5
MAX 8.8 4.2 6.2 0.62 1.35 0.5 0.46 0.139 0.6
X
Dimensions are in mm
C2
C1
MAX
F g
F
SYMBOL MIN TYP X 8.0 Y 4.0 Z Dimensions are in mm
1.0
Fig. 14
Fig. 15
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EM4100
Ordering Information Packaged Devices
This chart shows general offering; for detailed Part Number to order, please see the table "Standard Versions" below.
EM4100 A6 CI2LC - %%%
Version: A6 = Manchester, 64 clocks per bit A5 = Manchester, 32 clocks per bit B6 = Bi-phase, 64 clocks per bit B5 = Bi-phase, 32 clocks per bit C4 = PSK, 16 clocks per bit Package/Card & Delivery Form: CI2LC = CID Pack, 2 pins (length 2.5mm), in bulk CI2LB = CID Pack, 2 pins (length 2.5mm), in tape & reel CB2RC = PCB Package, 2 pins, in bulk Customer Version: %%% = only for custom specific version
Die Form
This chart shows general offering; for detailed Part Number to order, please see the table "Standard Versions" below. EM4100 A6 WS 11 E - %%%
Version: A6 = Manchester, 64 clocks per bit A5 = Manchester, 32 clocks per bit B6 = Bi-phase, 64 clocks per bit B5 = Bi-phase, 32 clocks per bit C4 = PSK, 16 clocks per bit Die form: WW = Wafer WS = Sawn Wafer/Frame WT = Sticky Tape WP = Waffle Pack (note 1) Customer Version: %%% = only for custom specific version Bumping: " " (blank) = no bumps E = with Gold Bumps (note 2) Thickness: 7 = 7 mils (178um) 11 = 11 mils (280um) 27 = 27 mils (686um)
Remarks: * For ordering please use table of "Standard Version" table below. * For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or packages, please contact EM Microelectronic-Marin S.A. * Note 1: This is a non-standard package. Please contact EM Microelectronic-Marin S.A for availability. * Note 2 : Direct connection using this version is subject to license. Please contact info@emmicroelectronic.com
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EM4100
Standard Versions:
The versions below are considered standards and should be readily available. For other versions or other delivery form, please contact EM Microelectronic-Marin S.A. Sales Office. Please make sure to give complete part number when ordering, without spaces.
Part Number EM4100A5CB2RC EM4100A5CI2LC EM4100A6CB2RC EM4100A6CI2LB EM4100A6CI2LC EM4100A6WP7 EM4100A6WS7 EM4100A6WT7 EM4100A6WW7 EM4100B5CB2RC EM4100B5CI2LC EM4100B6CB2RC EM4100B6CI2LC EM4100C4WS11 EM4100XXYYY-%%% Bit coding Manchester Manchester Manchester Manchester Manchester Manchester Manchester Manchester Manchester Bi-phase Bi-phase Bi-phase Bi-phase PSK custom Cycle/ bit 32 32 64 64 64 64 64 64 64 32 32 64 64 16 Package/Card/Die Form PCB Package, 2 pins CID package, 2 pins (length 2.5mm) PCB Package, 2 pins CID package, 2 pins (length 2.5mm) CID package, 2 pins (length 2.5mm) Die in waffle pack, 7 mils Sawn wafer, 7 mils Die on sticky tape, 7 mils Unsawn wafer, 7 mils PCB Package, 2 pins CID package, 2 pins (length 2.5mm) PCB Package, 2 pins CID package, 2 pins (length 2.5mm) Sawn wafer, 11 mils thickness custom Delivery Form / Bumping bulk bulk bulk tape bulk no bumps no bumps no bumps no bumps bulk bulk bulk bulk no bumps custom
Product Support
Check our Web Site under Products/RF Identification section. Questions can be sent to info@emmicroelectronic.com
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version. (c) EM Microelectronic-Marin SA, 0804 Rev. G
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